• Accessible for universities and research institutes.
  (Companies should contact the foundry directly. For SiGeMEMS, Companies should contact imec CMORE at www.imec.be/cmore)
• Prices and conditions may change at any time without prior notice.
• Depending on run participation or the number of submissions the schedule can be adapted or runs may be cancelled.
   

 

  imec CMORE
  SiGeMEMS

Technology Version	Standard Price	EU-Discounted Price
MEMS-only	4250 €	4000 €
CMOS integrated	28500 €	27000 €

• For each design submitted (one location), imec delivers 20 released dies.

 

Chip Characteristics

SiGeMEMS		MEMS-only	CMOS integrated
Die size (mm²)		5x5	5x5
CMOS integrated		no	TSMC 0.18um (CV018LD 1.8/3.3/32V)
# Metal layers		1	4 (= # Metal layers in CMOS)
Thickness	Electrode (SiGe)	400nm
	Vertical gap	3µm
	Structural SiGe layer	4µm
Smalles layout feature	SiGe Width	2µm
	SiGe spacing	500nm

 

  TRONICS Microsystems
  MEMSOI

Die size	Standard Price	EU-Discounted Price
4x4 mm	2500 €	2375 €
4x8 mm	3500 €	3225 €
8x8 mm	5000 €	4500 €

• For each design submitted (one location), Tronics delivers 20 dies, released and protected by a hermetic silicon wafer level package.
• Additional Services:
    - 100 € per additional die (min. quantities = 10 dies)
    - 200 € per additional die without release and without cap (min. quantities = 5 dies)

 

Chip Characteristics

Die sizes (mm²)	4x4	4x8	8x8
Available active area (mm²)	3.5x3.5	3.5x7.5	7.5x7.5
Number of pads or openings on the cap	Up to 12	Up to 18	Up to 24
	+ From simple to most complex functions + Hermetically sealed or open access
Hermetic Wafer Level Packaging	+ Industry state of the art standard for manufacturing  + Protection and ease of handling/integration
SOI	SOI = 60 µm BOX = 2 µm Bulk = 450 µm
Release	+ Structure released

 

  MEMSCAP MUMPs
  PolyMUMPs
  MetalMUMPs
  SOIMUMPs

PolyMUMPs, MetalMUMPs, SOIMUMPs	Standard Price	EU-Discounted Price
For 1 location "Standard Die Site"	3100 €	3000 €

• For each design submitted (one location), Memscap delivers 15 dies.
• Optional Post-Processing:
    - Subdicing: 150 € per cut per 15 die of any size from the same die location
    - HF Release: 600 € for up to 60 die of any size from the same die location
    - Supercritical CO2 Dry + HF Release: 1360 € for up to 60 die of any size from the same die location
    Note that available post-processing options depend on technology: see table below

 

Chip Characteristics & Available Post-Processing Options

	PolyMUMPs	MetalMUMPs	SOIMUMPs
Die size (mm²)	10x10
Available active area (mm²)	9.8x9.8	9.8x9.8	9x9
Number of dies delivered	15
Optional Post-Processing
Subdicing (per cut per 15 die of any size from the same die location)	150 €	150 €	Not available (can be done by design)
HF Release (for up to 60 die of any size from the same die location)	600 €	Not available (structures are standard released)	Not available (structures are standard released)
Supercritical CO2 Dry + HF Release (for up to 60 die of any size from the same die location)	1360 €	Not available (structures are standard released)	Not available (structures are standard released)

 

  MEMSCAP MUMPs
  MUMPs-PLUS!

The MUMPs-PLUS! service offers a low-cost pathway to semi-custom MEMS processing. MUMPs-PLUS! allows customers to specify thickness, material, or sequence changes and additions to the standard MUMPs processes and runs offered as part of the 2009 run schedule. MEMSCAP modifies the lot size to allow for a "mini-lot" that will be used to support the MUMPs-PLUS! customized flow. The customer pays the standard die price plus any costs associated with non-batched or non-standard steps.

For example, customer A has a device that requires the PolyMUMPs process PLUS a thicker Oxide1 layer and a patterned/etched backside. MEMSCAP will add extra wafers to the standard lot and run this "mini-lot" along with the standard lot for all of the processing common to both the standard and MUMPs-PLUS! custom flow. For the thicker Oxide1 and backside pattern/etch, MEMSCAP separates the wafers from the "mini-lot" from those in the standard lot to perform the custom processing. At the end of fabrication, MEMSCAP singulates and ships the customer die from the wafers in the "mini-lot". The MUMPs-PLUS! customer enjoys tremendous savings because there are no mask or processing costs for the standard steps, beyond the standard die site rate. The customer only pays for the non-batch and custom steps, plus any additional masks and engineering.

MUMPs-PLUS! may be ordered on any regularly scheduled run. To find out if your process sequence fits into the MUMPs-PLUS! framework, please contact the EUROPRACTICE MEMS MPW Service first. We will discuss your requirements with MEMSCAP or bring you in contact with MEMSCAP directly. Customers eligible for the EU-Discounted Price will get a similar discount for the common processing steps with standard lot (not on the non-batch and custom steps).

MUMPs-PLUS!	Standard Price	EU-Discounted Price
Please ask for a quotation