LETI-ePIXfab SiPhotonics: Passives with Heaters
LETI gives affordable access to its new photonic SOI 310nm platform on 200mm wafers. The process is based on the previous SOI220nm platform. It offers best performance for grating couplers. The multilevel option for Silicon patterning allows the design of various passive components, still coupled with thermal tuning capability by metal heaters. One AlCu level is also available for routing that is compatible with packaging.
Two process design kits (PDKs) are available through Phoenix BV suite and Cadence EDA software to help you to design your circuits, such as optical transceivers, optical switching, and many types of sensing. The PDKs give access to simulation environments such as ELDO or Aspic, and therefore allow co-simulation of complex circuits.
As shown in Figure 1, the LETI-ePIXfab SiPhotonics Passives with Heater technology consists of:
Users can also access "passives-only" technology on the runs of "passives with heater" technology.
SiPhotonics designers target a wide range of applications: