Silicon Photonics Packaging design rules
Europractice-IC provides access to photonic packaging. Users ordering photonic dies can also access packaged photonic chips.
The packaging is enabled through standardized design rules for electrical and optical ports. It is important that the users
use the packaging design rules to design the photonic chips. The packaging service is enabled by the PIXAPP Pilot Line and the Tyndall National Institute, Ireland.
Please mention your need for packaging in your contacts with firstname.lastname@example.org.
We will provide a confirmation document for your packaging order. This confirmation document is to be signed,
scanned and emailed back to us. This confirms the order for packaging. Order for packaging must follow the order for photonic dies within one month.