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  Imec-ePIXfab SiPhotonics Passives technology  
      

Basic characteristics

Schematic Cross section of the SiPhotonics technology

The imec passive silicon photonic IC technology (Imec SiPhotonics) offers:
  • substrate: SOI with 220nm Si, 2000nm BOX
  • WG module(WaveGuides): 220nm full Si etch for strip waveguides, photonic crystals, ...
  • FC module (FiberCoupler): 70nm partial Si etch for fiber couplers, rib waveguides, ...
  • Top cladding: deposited oxide or protective resist
  • Waveguide losses: 2.5-3dB/cm at 1550nm wavelength
  • Fiber coupler efficiency: ~30%, 1550nm center wavelength, 30nm 1dB bandwidth
  • Minimum linewidth: 120nm
  • Minimum pitch: 280nm
  • Statistical process tracking of WG and FC modules

Technology

Imec uses its advanced 200mm wafer fab:

  • 200mm pilot line
  • 0.13um mask technology (WG, FC)
  • 193nm Deep UV lithography, process optimized for generic photonics applications
  • ICP-RIE dry etch, process optimized for generic photonics applications
  • Oxide deposition and CMP tools
  • Statistical process control of all tools/chambers

Applications

SiPhotonics designers target a wide range of applications:
  • Datacom and short-reach optical interconnect
  • Telecom and access networks
  • Sensors (gas, pressure, strain) and read-out ICs
  • Biomedical: biomolecule detection, drug development, point-of-care diagnostics

Devices

High-index contrast silicon strip waveguide, 450nm (W) x 220nm (H)
Ring resonator (racetrack form). Due to the high index contrast a 5um bend radius can be used.
Arrayed waveguide grating (AWG) with 8 channels, 200GHz channel spacing. Device is 200um x 150um
A combination of two etch depths (FC and WG modules) is used to locally lower the refractive index contrast.
A grating coupler (FC module) coupling light from a single mode fiber to a strip waveguide.
       

 

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