Prototyping -- Packaging

New packaging prices : applicable on all MPW runs with deadline starting 1 February 2012.

EUROPRACTICE delivers unpackaged untested prototypes.

In addition EUROPRACTICE offers a low cost, flexible and coordinated packaging service using industrial qualified packaging houses.

A wide variety of packages are available ranging from DILs to PGAs and QFNs.  

Customers can have the standard unpackaged, untested prototypes packaged in the package they want at low cost. Please indicate at design submission/registration form the type of package and the number of chips you want to have assembled.

Price structuce of standard assembly :

• Unit price is valid for all packages and bonding of designs with pad pitch of min. 90 microns
• Minimum cost for all packages will be cost of 10 packages
• Cost for wire bonding length < 6mm and bondpad pitch >= 90um
• Cost for glass lids will be 150,00 Euro for 1 to 20 pcs. More than 20 pcs will be 7,50 Euro/pc.

Price List for standard available ceramic packages and standard assembly - February 2012

Attention !!
For all CPGA and CQFP packages setup cost of 200,00 Euro per bonding diagram needs to be paid.

SETUP cost for CPGA & CQFP	Euro
Qty
10 or more	200

 SETUP cost for DIL, CSOIC, CLCC, JLCC = 0 Euro

Unit Prices			Unit Prices
Type	Euro		Type	Euro
DIL 16	26		JLCC 44	50
DIL 18	28		JLCC 68	63
DIL 24	33		JLCC 84	77
DIL 28	40		CPGA 84	64
DIL 40	43		CPGA 100	70
DIL 48	50		CPGA 120	77
CSOIC 16	55		CPGA 144	92
CSOIC 20	64		CPGA 208	144
CSOIC 24	67		CPGA 256	187
CSOIC 28	70		CQFP 64	65
CLCC 44	43		CQFP 120	98
CLCC 68	53		CQFP 160	109
CLCC 84	59		CQFP 208	136

Price List for Plastic "Open-Pak" packages SOIC & QFN, February 2012

Be aware that silicon thickness for "Open-Pak" plastic types may not exceed 11 mils so please check with technology responsible

SETUP cost for Plastic Open-Pak SOIC and QFN	Euro
Qty
10 or more	300

 

Unit Prices			Unit Prices
Type	Euro		Type	Euro
(Body width .300)			QFN 16 (5x5)	36
SOIC 16	48		QFN 24 (5x5)	47
SOIC 20	53		QFN 32 (5x5)	55
SOIC 24	54		QFN 48 (7x7)	62
SOIC 28	58		QFN 56 (8x8)	66
--	--		QFN 64 (9x9) NEW	75
--	--		QFN 80 (12x12) NEW	84

 

Price list for Non-standard assembly for which price quotation on request and case by case

• Pad pitches smaller than 90um (see above)
• Bondpad opening smaller than 60um x 60um
• Bondwires larger than 6mm or shorter than 1,50mm
• Bondwire angle to sharp (<45° )
• Other bondwire thickness or type
• To many downbonds from circuit to cavity or from package pin to cavity
• Double/triple or more bondwires to 1 package pin
• Bondpads not inline or inside circuit
• Special placement of die into cavity
• Package which is not on our Europractice list (see below)
• Special treatments during assembly
• Stud Bumps

Price list for Non-standard ceramic and   plastic "Open-Pak" packages (not on our Europractice list)

• market cost for package type
• minimum cost : 250 euro + cost of 10 packages.

Plastic packages for small quantities (<100 units)

• applicable to standard plastic packages available as open-tool on the market
• assembly cost on request
• extra delivery time of a few weeks