Technologies

EUROPRACTICE has signed agreements with several leading foundries and library vendors to offer low cost ASIC prototyping (MPW) and small-medium volume production.

The offering includes IC technologies from the following foundries

	ON Semiconductor (formerly AMIS) The technologies offered include basic 0.7µ, 0.5µ and 0.35µ CMOS logic and mixed and high-voltage 0.7µ, 0.5µ and 0.35µ CMOS. The ON Semi design rules, spice parameters, design manuals and standard cell libraries and design kits are available through EUROPRACTICE after signing the DKLA. For reduced-cost single project engineering runs, MLM (Multi Level Mask) mask set is possible. ON Semi offers for all their technologies the possibility of stitching, allowing to fabricate large image sensor chips (larger than reticle field).
	ams The technologies offered include basic 0.8µ - 0.18µ CMOS logic, mixed and high-voltage 0.8µ and 0.18µ CMOS, high-speed 0.35µ SiGe BiCMOS and 0.35µ CMOS OPTO for image sensors. The ams design rules, spice parameters and design kits are available through EUROPRACTICE after signing the CA and HKLA.
	IHP The technologies offered include high-speed 0.25µ - 0.18µ SiGe:C BiCMOS. The IHP design rules, spice parameters and design manuals are available through EUROPRACTICE after signing the NDA.
	LFoundry LFoundry's initial offering will be the LF150 modular 0.15µm Low Power and RF CMOS process, providing up to six levels of Aluminum interconnects, MIM capacitor, polymide passivation and I/O voltages of 1.8V, 3.3V and 5.0V. All silicon is produced at LFoundry's state-of-the-art 200mm wafer fab in Landshut, Germany. A large portfolio of process-proven libraries, IP, design tools and reference flows is supported. Low volume manufacturing with a flexible approach of the customer requirements is also offered at low cost.
	TSMC TSMC is offering a wide range of technologies. Universities and research institute Universities and research institutes can only access 0.25u, 0.18u, 0.13u, 90nm, 65nm and 40nm CMOS based logic and mixed-signal/RF technologies (see procedures under Foundry Access). The TSMC design rules, spice parameters and design kits are available through EUROPRACTICE after signing the NDA. Standard cell libraries and design kits for the TSMC technologies are available from companies like ARM (artisan). Companies Companies can access a wide range of TSMC technologies ranging from 0.5u down to 40nm, including all flavors available such as logic, mixed-signal/RF, e-flash, SiGe, CIS (CMOS Imaging Sensor),... Companies can get access to these technologies as well as for prototyping as for volume production
	UMC The technologies offered include 0.25µ, 0.18µ, 0.13µ, 90nm and 65nm CMOS logic and mixed. In addition also the 0.35µ, 0.25µ and 0.18µ CIS (CMOS Imaging Sensor) technologies are offered for image sensors. The UMC design rules, spice parameters and design kits are available through EUROPRACTICE after signing the NDA. Standard cell libraries and design kits for the UMC technologies are available from Faraday.
Microsystems & MEMS Technologies :
	MEMSCAP The Multi-User MEMS Processes, or MUMPs®, is a well-established program that has run consistently since 1992. Over 80 full process runs have been completed and shipped over that time to hundreds of organizations. MEMSCAP offers three unique stand-alone, multi-mask MEMS processes in MUMPs® : PolyMUMPs, SOIMUMPs, and MetalMUMPs.