EUROPRACTICE has signed agreements with several leading foundries and library vendors to offer low cost ASIC prototyping (MPW) and small-medium volume production.
The offering includes IC technologies from the following foundries
ON Semiconductor (formerly AMIS)
LFoundry's initial offering will be the LF150 modular 0.15µm Low Power and RF CMOS process, providing up to six levels of Aluminum interconnects, MIM capacitor, polymide passivation and I/O voltages of 1.8V, 3.3V and 5.0V. All silicon is produced at LFoundry's state-of-the-art 200mm wafer fab in Landshut, Germany. A large portfolio of process-proven libraries, IP, design tools and reference flows is supported. Low volume manufacturing with a flexible approach of the customer requirements is also offered at low cost.
Universities and research institute
Universities and research institutes can only access 0.25u, 0.18u, 0.13u, 90nm, 65nm and 40nm CMOS based logic and mixed-signal/RF technologies (see procedures under Foundry Access).
The TSMC design rules, spice parameters and design kits are available through EUROPRACTICE after signing the NDA. Standard cell libraries and design kits for the TSMC technologies are available from companies like ARM (artisan).
Companies can access a wide range of TSMC technologies ranging from 0.5u down to 40nm, including all flavors available such as logic, mixed-signal/RF, e-flash, SiGe, CIS (CMOS Imaging Sensor),...
Companies can get access to these technologies as well as for prototyping as for volume production
The Multi-User MEMS Processes, or MUMPs®, is a well-established program that has run consistently since 1992. Over 80 full process runs have been completed and shipped over that time to hundreds of organizations. MEMSCAP offers three unique stand-alone, multi-mask MEMS processes in MUMPs® : PolyMUMPs, SOIMUMPs, and MetalMUMPs.