AMI Semiconductor (AMIS)

The technologies offered include basic 0.7µ, 0.5µ and 0.35µ CMOS logic and mixed and high-voltage 0.7µ, 0.5µ and 0.35µ CMOS. The AMIS design rules, spice parameters, design manuals and standard cell libraries and design kits are available through EUROPRACTICE after signing the DKLA. For reduced-cost single project engineering runs, MLM (Multi Level Mask) mask set is possible. AMIS offers for all their technologies the possibility of stitching, allowing to fabricate large image sensor chips (larger than reticle field).

austriamicrosystems

The technologies offered include basic 0.8µ -- 0.35µ CMOS logic, mixed and high-voltage 0.8µ and 0.35µ CMOS, high-speed 0.35µ SiGe BiCMOS and 0.35µ CMOS OPTO for image sensors. The austriamicrosystems design rules, spice parameters and design manuals are available through EUROPRACTICE after signing the CA and NDA.

IHP

The technologies offered include high-speed 0.25µ SiGe:C BiCMOS. The IHP design rules, spice parameters and design manuals are available through EUROPRACTICE after signing the NDA.

TSMC

TSMC is offering a wide range of technologies.

Universities and research institute

Universities and research institutes can only access 0.25u, 0.18u and 0.13u CMOS based logic and mixed-signal/RF technologies (see procedures under Foundry Access).

The TSMC design rules, spice parameters and design kits are available through EUROPRACTICE after signing the NDA. Standard cell libraries and design kits for the TSMC technologies are available from companies like ARM (artisan).

Companies

Companies can access a wide range of TSMC technologies ranging from 0.5u down to 65nm, including all flavors available such as logic, mixed-signal/RF, e-flash, SiGe, CIS (CMOS Imaging Sensor),...

Companies can get access to these technologies as well as for prototyping as for volume production

UMC

The technologies offered include 0.25µ, 0.18µ, 0.13µ and 90nm CMOS logic and mixed. In addition also the 0.35µ, 0.25µ and 0.18µ CIS (CMOS Imaging Sensor) technologies are offered for image sensors. The UMC design rules, spice parameters and design kits are available through EUROPRACTICE after signing the NDA. Standard cell libraries and design kits for the UMC technologies are available from Faraday.

Microsystems & MEMS Technologies :

TRONICS

The MEMSOI MPW service provides access to Tronics 60µm thick SOI High Aspect Ratio Micromachining (SOI-H.A.R.M.). The technology is developed to manufacture high performance custom inertial sensors, using capacitive comb drive structures for sensing and actuation and can be used for a variety of devices like accelerometers and gyros, resonators, grippers, mechanical switches and microfluidics structures.

MEMSCAP

The Multi-User MEMS Processes, or MUMPs®, is a well-established program that has run consistently since 1992. Over 80 full process runs have been completed and shipped over that time to hundreds of organizations. MEMSCAP offers three unique stand-alone, multi-mask MEMS processes in MUMPs® : PolyMUMPs, SOIMUMPs, and MetalMUMPs.